Design And Construction Of An Electroplating Bath

ABSTRACT

This work is on a copper electroplating bath composition. In particular, the present invention relates to cooper electroplating in the fabrication of interconnect structures in semiconductor devices. By use of the inventive copper eletroplating bath composition, the incidence of voids in the interconnect structures is reduced.

TABLE OF CONTENTS

COVER PAGE

TITLE PAGE

APPROVAL PAGE

DEDICATION

ACKNOWELDGEMENT

ABSTRACT

CHAPTER ONE

• INTRODUCTION
• BACKGROUND OF THE PROJECT
• OBJECTIVE OF THE STUDY
• SIGNIFICANCE OF THE STUDY
• LIMITATION OF THE STUDY
• BENEFIT OF THE PROJECT
• APPLICATION OF THE STUDY
• RESEARCH QUESTIONS
• PROJECT ORGANISATION

CHAPTER TWO

LITERATURE REVIEW

• OVERVIEW OF ELECTROPLATING
• REVIEW OF ELECTROPLATING PROCESS
• HISTORICAL BACKGROUND OF ELECTROPLATING
• CONSIDERATION FOR ELECTROPLATING
• TYPES OF ELECTROPLATING

CHAPTER THREE

METHODOLOGY

• BASICS OF ELECTROPLATING
• WORKING PRINCIPLE
• DIAGRAM OF AN ELECTROPLATING PLATE
• ELECTROPLATING PROCESS STEPS
• ELECTROPLATING PROCESS STEPS
• WORKING OF COPPER ELECTROPLATING BATH

CHAPTER FOUR

• RESULT ANALYSIS
• FACTORS GOVERNING ELECTROPLATING
• ELECTROLYTIC BATH
• PRECAUTIONS IN ELECTROPLATING PROCESS

CHAPTER FIVE

• CONCLUSION
• RECOMMENDATION
• REFERENCES

CHAPTER ONE

1.0                                          INTRODUCTION

1.1                            BACKGROUND OF THE STUDY

The proposed system is on a electroplating bath. In particular, the present invention relates to copper electroplating in the fabrication of interconnect structures in semiconductor devices.

Copper electroplating processes have been used in the semiconductor industry to fill structures such as dual damascene trenches and contact holes. Miniaturization is the process of reducing the size of semiconductor devices, while crowding more devices onto a relatively smaller area of a substrate.

One phenomenon that is observed during semiconductor fabrication electroplating is the formation of defects such as voids in the metallization. As miniaturization continues to progress, the relative size of a void increases. A significant number of voids will result in a detrimentally lowered conductivity of a metallization such as a contact as well as poor resistance. In some cases, the void or voids may be sufficiently large to cause an open circuit and the device fails.

copper plating baths may result in a detrimental defect- or voids count besides the contact fill capability may be compromised and incomplete filling may be observed in the contacts. What is needed is an electroplating bath composition and process that overcomes the problems of the prior art. What is also needed is an inventive contact that overcomes the problems of the prior art.

1.2                                    AIM OF THE PROJECT

The aim of this study is design or setup a copper type of electroplating bath.

1.3                          SIGNIFICANCE OF THE PROJECT

Electroplating is the process of plating one metal over another. It is done for various purposes, most commonly for imparting corrosion resistance and decorative appearance. There are a number of advantages of this process:

1. Corrosion resistance: a corrosion-prone substance such as iron can be coated with a layer of non-corrosive material, thereby protecting the original material.
2. Decorative items: shine and luster can be imparted to otherwise dull surfaces. This makes for great decorative items.

• Cheaper ornaments: instead of making ornaments out of gold or silver, one can make them using cheaper metals and electroplate the ornaments with gold. This reduces the cost of ornaments greatly.

1. improving mechanical characteristics: electroplating can also improve the mechanical characteristics of metals.

1.4                            LIMITATION OF THE PROJECT

There are a number of disadvantages of this process as well, such as:

1. Non-uniform plating: electroplating may or may not be uniform and this may result in a substandard appearance of the plated material.
2. Cost: the process is costly and time consuming.

• Pollution potential: the electroplating solution, after use, needs to be disposed off safely and is a cause of environmental concern.

1.5                                BENEFIT OF THE PROJECT

Adding metal plating to your parts can improve their durability and performance or alter their characteristics by increasing conductivity or reducing friction. Electroplating can provide numerous benefits that have made it invaluable in engineering and many other industries. Below are the benefits of adding a metal coating to your parts through electroplating:

1. Resistance to Corrosion:Electroplating can protect against corrosion and other atmospheric conditions and better withstand more extreme conditions. This allows parts with metal coating to last longer, so you can replace them less often.
2. Resistance to Wear and Abrasions:Metal coating adds a protective layer that improves resistance to abrasions and wear. Plated parts are less likely to be damaged when dropped, and brittle parts become more durable after electroplating. The metal coating will also dissolve or disintegrate before the base material, which allows the substrate it to retain its quality longer.

• Increased Thickness:For manufacturing processes that require extreme thickness, metal coating can be used. Palladium is a popular choice for increasing the thickness of parts. Added thickness also leads to more durability and increased lifespan.

1. Increased Solderability: Adding metal plating to a substrate can make it easier to solder, which is beneficial when a metal with low solderability is desired for a specific project.
2. Resistance to Temperature:Electroplating with metals such as zinc-nickel or gold can protect the substrate against extremely high temperatures that machine or engine parts can be subjected to. This prevents heat damage and increases the longevity of parts.
3. Better Electrical Conductivity:Electroplating with highly conductive metals, such as silver, can increase the conductivity of connectors or wires. This is an important application in the electronics industry or for other electrical components.

• Reduced Friction:Friction in electrical connectors and other parts can cause excess heat and wear. Electroplating with metals such as nickel can reduce friction to prevent wear and tear on parts.
• Better Adhesion:Some metal coatings, such as copper, provide an undercoating that allows for better adhesion of paint or additional levels of coating. This, in turn, leads to improved surface uniformity and finish appearance of the final coating.

1. Better Torque Tolerance:Electroplating can strengthen a substrate, so it becomes more tolerant to torque without breaking or becoming damaged. This can be beneficial in machine parts that experience a lot of strain.

1.6                                          APPLICATION OF THE PROJECT

Electroplating has applications in a wide variety of industries, including electronics, automotive, aerospace, medical, optics and oil and gas. While specific uses vary by sector, electroplating is generally used to improve the performance or appearance of a product or to protect it from wear. In the engineering field, electroplating has many benefits, including preventing corrosion, increasing conductivity and improving the durability of parts.

1.7                                               RESEARCH QUESTIONS

1. What is the principle of electroplating?
2. Why is copper used in electroplating?

• Which electrolyte is used for electroplating of copper?

1.8                                                         PROJECT ORGANISATION

The work is organized as follows: chapter one discuses the introductory part of the work,   chapter two presents the literature review of the study,  chapter three describes the methods applied,  chapter four discusses the results of the work, chapter five summarizes the research outcomes and the recommendations.